Ÿ	Copper requires more heat to open the pore structure of the surface.

Ÿ	Clean the work surface and heat until you can leave a fine streak with the rod by using a striking motion (like striking a match).

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When this streak appears, continue adding more heat. You will see the test streak starting to be absorbed into the surface. The rod will flow onto the surface well before the streak starts to disappear into the surface. However the pores are not open yet, and therefore penetration is not occurring, so the repair will not be strong.

Ÿ	Be sure to continue heating the copper until you see signs of penetration in the test streak, and only then start adding More HTS-2000.

Ÿ	When the pores are opened properly, a very strong repair will result.

Ÿ	Unlike silver solder, which needs an acidic flux, HTS-2000 leaves no harmful residues.